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- W2011125611 abstract "Purpose – Optimisation of the package design in order to reduce stresses in a plastic small outline J‐lead (SOJ) package and to thereby prevent fractures during the infrared soldering process." @default.
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- W2011125611 date "2005-03-01" @default.
- W2011125611 modified "2023-09-23" @default.
- W2011125611 title "Improving the reliability of a plastic IC package in the reflow soldering process by DOE" @default.
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- W2011125611 doi "https://doi.org/10.1108/09540910510581147" @default.
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