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- W2011225607 abstract "Summary form only given. Pre-applied underfill materials for eutectic tin lead flip chip solder attach have been developed to produce void free, reliable assemblies. Lead free flip solder attach presents a number of challenges for quality assembly using pre-applied underfill. Factors that effect fluxing, yield, and voiding will be addressed" @default.
- W2011225607 created "2016-06-24" @default.
- W2011225607 creator A5050374434 @default.
- W2011225607 date "2006-08-08" @default.
- W2011225607 modified "2023-09-26" @default.
- W2011225607 title "Materials and Processing Impacts on Flip Chip Assembly using Pre-applied Underfill" @default.
- W2011225607 doi "https://doi.org/10.1109/isapm.2006.1665986" @default.
- W2011225607 hasPublicationYear "2006" @default.
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