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• W2011397248 abstract "This study reports the kinetics of the bonding process of a Cu bump/ thick Sn bonding layer/Cu bump bonding structure, popularly adopted for three-dimensional (3D) packaging, and the mechanical properties of the joints. Characterizing the bonding morphologies of the joints using scanning electron microscopy disclosed that a drastic intermetallic phase transformation occurred around the melting temperature of Sn in a manner similar to the wetting process of SnPb solder on Cu. We also delved into the mechanical behavior of the joints using lap-shear testing to illuminate that a unique feature of the joints is a lack of ductility. In addition, the samples exhibited a sensitive dependence of the joint strength on the bonding conditions (temperature and pressure)." @default.
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• W2011397248 date "2010-01-01" @default.
• W2011397248 modified "2023-10-17" @default.
• W2011397248 title "A Study on the Bonding Process of Cu Bump/Sn/Cu Bump Bonding Structure for 3D Packaging Applications" @default.
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• W2011397248 doi "https://doi.org/10.1149/1.3301931" @default.
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