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- W2011718638 abstract "Abstract Sn–40.5 wt%Pb–2.6 wt%Sb ternary alloy was directionally solidified with a constant temperature gradient (G = 18 K/mm) and growth rates ranging from 1 μm/s to 30 μm/s. Experimental results indicated that the lamellar structure consisted of Pb-rich and Sn-rich phases. The lamellar spacings (λ) and microhardness (HV) were measured and the HV increased with increasing growth rate (V) or decreased with increasing lamellar spacing. The dependences of λ and HV on V were determined by using a linear regression analysis. The relationships between the λ, V and HV were given as: λ = 3.39 V − 0.51 , H V = 12.65 V 0.11 and H V = 16.42 λ − 0.2 , respectively. The fitted exponent values were in accordance with the previous experimental results obtained from Sn–Pb alloys and In–Bi–Sn ternary alloys." @default.
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- W2011718638 date "2010-03-01" @default.
- W2011718638 modified "2023-09-24" @default.
- W2011718638 title "Research on lamellar structure and microhardness in directionally solidified ternary Sn–40.5Pb–2.6Sb eutectic alloy" @default.
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- W2011718638 doi "https://doi.org/10.1016/j.jallcom.2009.12.086" @default.
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