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- W2011762315 abstract "In a phase change memory (PCM), the device resistance increases slowly with time after the formation of the amorphous phase, thus affecting the stability of stored data. This work investigates the resistance drift in thin films of amorphous Ge2Sb2Te5 and in PCMs, demonstrating a common kinetic of drift in stressed/unstressed films and in the nanometer-size active volume of a PCM with different stress levels developed via stressor layers. It is concluded that stress is not the root cause of PCM drift, which is instead attributed to intrinsic structural relaxation due to the disordered, metastable nature of the amorphous chalcogenide phase." @default.
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- W2011762315 date "2011-11-28" @default.
- W2011762315 modified "2023-10-16" @default.
- W2011762315 title "Role of mechanical stress in the resistance drift of Ge<sub>2</sub>Sb<sub>2</sub>Te<sub>5</sub> films and phase change memories" @default.
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- W2011762315 doi "https://doi.org/10.1063/1.3664631" @default.
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