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- W2012022099 abstract "The effect of fluid flow on the scaling properties of roughness during surface growth is studied by copper electrodeposition (and silver electrodeposition, for comparison) and atomic force microscopy measurements. The electrodeposited surface becomes smoother as the Reynolds number increases. Furthermore, fewer growth sites are observed at higher flow rates. Scaling analysis of the self-affine surface indicates that the saturated root-mean-square height decreases with increasing flow and the roughness depends on the fraction of the limiting current. The experimental scaling exponents can be divided into universal and local exponents, and , where the local growth exponent depends on the flow as expressed by the fraction of the limiting current and is the mass-transfer-dependent component of the roughness exponent. In order to generalize the results, similar experiments with silver electrodeposition show the same trend. The universal roughness exponent and the universal growth exponent are obtained by extrapolation to infinite flow velocity . The scaling exponents are found to be isotropic, as they are independent of the flow direction." @default.
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- W2012022099 date "2008-01-01" @default.
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- W2012022099 title "Isotropic Effect of Fluid Flow on Scaling of Surface Roughness during Copper Electrodeposition" @default.
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