Matches in SemOpenAlex for { <https://semopenalex.org/work/W2012084084> ?p ?o ?g. }
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- W2012084084 endingPage "85" @default.
- W2012084084 startingPage "67" @default.
- W2012084084 abstract "Extensive use of thick film materials to manufacture resistor networks and hybrid integrated circuits has come about because of economic, processing and functional advantages over other technologies in the high volume production of miniaturized circuits. Inherent in the adoption of thick film technology for increasingly diverse applications has been the ability of thick film material suppliers to provide progressive performance improvements at lower cost concurrent with circuit manufacturer's needs. Since the first major commercial thick film adoption in the early sixties, when IBM adopted platinum gold conductors and palladium silver resistors in their 360 computers, rapid technological advances over the last decade have produced an increasing variety of hybrid circuits and networks. The wide adoption of thick film technology in all segments of the electronic industry has placed increasing demands on performance and processing latitude. This paper outlines the development of low cost silver-bearing conductors and describes the evolution of technology improvements to present day systems. The initial segment reviews the deficiencies of early Pd/Ag conductors, particularly solder leach resistance and degradation of soldered adhesion following high temperature storage, and focuses on the first Pd/Ag system which overcame these problems. Extension of this technology and subsequent improvements in both binders and vehicles to fulfill adhesion requirements to Al 2 O 3 substrates of varying chemistries and to meet demands for high speed printing are also described. The second segment gives an overview of the present understanding of thick film conductor composites from a mechanistic point of view. The various types of binder systems commonly employed in conductors are discussed in terms of how they effect a bond between the sintered metal and the substrate, and the advantages and disadvantages of each type. Metallurgical aspects of conductor/solder connections are considered and their effects on bond reliability following exposure to high temperature discussed. Rheological considerations of paste design are presented and related to printing performance. The final segment focuses on newer low cost, high performance material systems that have evolved over the past two years. The technologies of each system are reviewed in terms of metallurgy, binder and vehicle. Important functional properties are presented to illustrate cost/performance tradeoffs. Special emphasis is given to recently developed high Ag containing conductors which have outstanding soldered adhesion even after 1000 hours of storage at 150℃." @default.
- W2012084084 created "2016-06-24" @default.
- W2012084084 creator A5004568173 @default.
- W2012084084 creator A5038964804 @default.
- W2012084084 creator A5042454502 @default.
- W2012084084 creator A5075423944 @default.
- W2012084084 creator A5081909185 @default.
- W2012084084 date "1981-01-01" @default.
- W2012084084 modified "2023-09-26" @default.
- W2012084084 title "Advances in Low Cost Silver-Containing Thick Film Conductors" @default.
- W2012084084 doi "https://doi.org/10.1155/apec.9.67" @default.
- W2012084084 hasPublicationYear "1981" @default.
- W2012084084 type Work @default.
- W2012084084 sameAs 2012084084 @default.
- W2012084084 citedByCount "9" @default.
- W2012084084 countsByYear W20120840842012 @default.
- W2012084084 countsByYear W20120840842014 @default.
- W2012084084 countsByYear W20120840842015 @default.
- W2012084084 countsByYear W20120840842016 @default.
- W2012084084 countsByYear W20120840842020 @default.
- W2012084084 countsByYear W20120840842022 @default.
- W2012084084 crossrefType "journal-article" @default.
- W2012084084 hasAuthorship W2012084084A5004568173 @default.
- W2012084084 hasAuthorship W2012084084A5038964804 @default.
- W2012084084 hasAuthorship W2012084084A5042454502 @default.
- W2012084084 hasAuthorship W2012084084A5075423944 @default.
- W2012084084 hasAuthorship W2012084084A5081909185 @default.
- W2012084084 hasBestOaLocation W20120840841 @default.
- W2012084084 hasConcept C117671659 @default.
- W2012084084 hasConcept C119599485 @default.
- W2012084084 hasConcept C123745756 @default.
- W2012084084 hasConcept C127413603 @default.
- W2012084084 hasConcept C134146338 @default.
- W2012084084 hasConcept C137488568 @default.
- W2012084084 hasConcept C165801399 @default.
- W2012084084 hasConcept C171250308 @default.
- W2012084084 hasConcept C192562407 @default.
- W2012084084 hasConcept C202374169 @default.
- W2012084084 hasConcept C21880701 @default.
- W2012084084 hasConcept C41008148 @default.
- W2012084084 hasConcept C530198007 @default.
- W2012084084 hasConcept C61696701 @default.
- W2012084084 hasConcept C76155785 @default.
- W2012084084 hasConceptScore W2012084084C117671659 @default.
- W2012084084 hasConceptScore W2012084084C119599485 @default.
- W2012084084 hasConceptScore W2012084084C123745756 @default.
- W2012084084 hasConceptScore W2012084084C127413603 @default.
- W2012084084 hasConceptScore W2012084084C134146338 @default.
- W2012084084 hasConceptScore W2012084084C137488568 @default.
- W2012084084 hasConceptScore W2012084084C165801399 @default.
- W2012084084 hasConceptScore W2012084084C171250308 @default.
- W2012084084 hasConceptScore W2012084084C192562407 @default.
- W2012084084 hasConceptScore W2012084084C202374169 @default.
- W2012084084 hasConceptScore W2012084084C21880701 @default.
- W2012084084 hasConceptScore W2012084084C41008148 @default.
- W2012084084 hasConceptScore W2012084084C530198007 @default.
- W2012084084 hasConceptScore W2012084084C61696701 @default.
- W2012084084 hasConceptScore W2012084084C76155785 @default.
- W2012084084 hasIssue "1" @default.
- W2012084084 hasLocation W20120840841 @default.
- W2012084084 hasOpenAccess W2012084084 @default.
- W2012084084 hasPrimaryLocation W20120840841 @default.
- W2012084084 hasRelatedWork W2016107180 @default.
- W2012084084 hasRelatedWork W2056726645 @default.
- W2012084084 hasRelatedWork W2145318291 @default.
- W2012084084 hasRelatedWork W2352765979 @default.
- W2012084084 hasRelatedWork W2381414832 @default.
- W2012084084 hasRelatedWork W2490684934 @default.
- W2012084084 hasRelatedWork W2493490124 @default.
- W2012084084 hasRelatedWork W2899084033 @default.
- W2012084084 hasRelatedWork W3003527510 @default.
- W2012084084 hasRelatedWork W3216530552 @default.
- W2012084084 hasVolume "9" @default.
- W2012084084 isParatext "false" @default.
- W2012084084 isRetracted "false" @default.
- W2012084084 magId "2012084084" @default.
- W2012084084 workType "article" @default.