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- W2012182877 abstract "No one doubts that Through Silicon Via (TSV) is one of the necessary technologies for three-dimensional integration of LSIs. Heterogeneous system integration is a good candidate for its application, which includes the “Vision Chip” [1]. TSV technology is applied to a CMOS imager sensor camera module for mobile handsets and successfully achieves a size reduction of 55% in volume and 36% in footprint, which we refer to as a Chip Scale Camera Module (CSCM). To the best of our knowledge, CSCM is the first mass-produced product using TSV technology." @default.
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- W2012182877 date "2009-02-01" @default.
- W2012182877 modified "2023-10-17" @default.
- W2012182877 title "Chip Scale Camera Module (CSCM) using Through-Silicon-Via (TSV)" @default.
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- W2012182877 doi "https://doi.org/10.1109/isscc.2009.4977515" @default.
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