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- W2012192819 startingPage "175" @default.
- W2012192819 abstract "The relative electromigration performances of Al-Cu conductor stripes with various combinations of sputtered quartz and polyimide passivation above and below the conductor were compared. A vertical structure with polyimide above and sputtered quartz below the conductor proved to be the best. A model is constructed where it is shown that passivation defects are important in the reliability of thin film conductor stripes." @default.
- W2012192819 created "2016-06-24" @default.
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- W2012192819 date "1982-05-01" @default.
- W2012192819 modified "2023-10-17" @default.
- W2012192819 title "Electromigration in Al-Cu thin films with polyimide passivation" @default.
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- W2012192819 doi "https://doi.org/10.1016/0040-6090(82)90431-x" @default.
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