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• W2012202232 startingPage "860" @default.
• W2012202232 abstract "The miniature thermoelectric cooler (TEC) is a promising device for microelectronics applications with high cooling performance and short response time. In this paper, a comprehensive numerical analysis focusing on the cooling performance and response time of the TEC is performed by finite element methods (FEMs). The effects of load current, geometric size, ratio of length to cross-sectional area and substrate's thermal resistance on the performance of the TEC are studied. The results show that the performance of TECs has been improved by reducing the TEC's size and ratio of length to cross-sectional area, resulting in a maximum cooling temperature difference of 88 °C, a cooling power density of 1000 W cm−2 and a short response time on the order of milliseconds. Furthermore, the substrate, which hinders the circulation of heat between the TEC and the atmosphere, also has a significant influence on the performance of the TEC." @default.
• W2012202232 created "2016-06-24" @default.
• W2012202232 creator A5000970532 @default.
• W2012202232 creator A5013162863 @default.
• W2012202232 creator A5014079387 @default.
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• W2012202232 date "2013-09-01" @default.
• W2012202232 modified "2023-10-15" @default.
• W2012202232 title "Finite element analysis of miniature thermoelectric coolers with high cooling performance and short response time" @default.
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• W2012202232 doi "https://doi.org/10.1016/j.mejo.2013.06.013" @default.
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