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- W2012242833 abstract "Abstract Molecular dynamics simulations using tight-binding methods or based on an empirical potential derived from the tight-binding approximation have been employed to describe atomic interactions at interfaces created by the macroscopic wafer bonding process. The bond order potentials including π-bonds are used to predict the interaction of diamond wafer surfaces: strong covalent bonding is possible for flat and clean C(0 0 1)-2×1 surfaces under ultrahigh vacuum (UHV) conditions and at room temperature, C(1 1 1)-2×1 surfaces will bond very weakly and debond already at moderate temperatures." @default.
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- W2012242833 date "2001-11-01" @default.
- W2012242833 modified "2023-09-27" @default.
- W2012242833 title "Tight-binding-based empirical potentials: Molecular dynamics of wafer bonding" @default.
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- W2012242833 doi "https://doi.org/10.1016/s0927-0256(01)00165-3" @default.
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