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- W2012503806 abstract "Abstract The effect of different mechanical processes on creep crack growth has been studied in Cu and Cu + 1 wt% Sb at temperatures ranging from 450 to 650°C. Crack growth experiments have been conducted under several different loading conditions including constant C ∗ . The results of these experiments indicate that a coupling of creep damage near the crack tip and power law creep in the ligament control crack propagation early in the life of the specimen. The results also suggest that, later in the experiment, a second stage of crack growth occurs which is influenced only by creep damage mechanisms. Stable crack growth behavior under constant displacement rate conditions is observed during this second stage of crack growth where C ∗ is not valid as a characterizing parameter." @default.
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- W2012503806 date "1987-02-01" @default.
- W2012503806 modified "2023-09-27" @default.
- W2012503806 title "Characterizations of high temperature crack growth in copper and Cu + 1 wt% Sb under different loading conditions" @default.
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- W2012503806 doi "https://doi.org/10.1016/0001-6160(87)90252-5" @default.
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