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• W2013380741 abstract "Purpose – The reliability of chip‐on‐film (COF) packages is fundamentally dependent upon the quality of the eutectic Au‐Sn joint formed between the Au bumps on the integrated circuit (IC) device and the Sn‐plated Cu inner leads. Therefore, it is essential that an appropriate bonding temperature is achieved during the inner lead bonding (ILB) process. The purpose of this paper is to identify the optimal processing conditions which maximize the reliability of the Au‐Sn joints." @default.
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• W2013380741 date "2010-09-21" @default.
• W2013380741 modified "2023-09-27" @default.
• W2013380741 title "An experimental and numerical investigation into the effects of the chip‐on‐film (COF) processing parameters on the Au‐Sn bonding temperature" @default.
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• W2013380741 doi "https://doi.org/10.1108/09540911011076862" @default.
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