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- W2013847214 abstract "Silver nanoparticle pastes are promising materials for high temperature interconnection particularly above 400 °C. Reliability is a major concern in interconnection and it mainly depends on the behavior under the stress induced by thermal cycling. The joint microstructure is then a crucial parameter for reliability and determines the electrical, mechanical and thermal properties. Here, an investigation procedure is proposed to describe the microstructure of a joint and to monitor its evolution in real-time during the sintering. Combining electron and x-ray diffraction with electrical resistance measurement and secondary ion mass spectroscopy, our method is used on a sample made out of a home-made silver nanoparticle paste. The influence of the chemical composition of the paste on the microstructure is discussed as well as the compatibility of the paste for oxide interconnection." @default.
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- W2013847214 date "2015-03-13" @default.
- W2013847214 modified "2023-09-27" @default.
- W2013847214 title "Microstructure and electrical resistance evolution during sintering of a Ag nanoparticle paste" @default.
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- W2013847214 doi "https://doi.org/10.1088/0022-3727/48/14/145302" @default.
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