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- W2013947404 abstract "Power electronics packaging, like integrated power modules, constitute an advanced technology leading to power density increase, weight and volume decrease and enhancing the reliability level. However, the continuous increase of the voltage lead to questions regarding power device environment. We discuss in the following different solutions able to achieve the electric stress gradation." @default.
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- W2013947404 date "2007-10-01" @default.
- W2013947404 modified "2023-10-01" @default.
- W2013947404 title "Stress grading in integrated power modules" @default.
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- W2013947404 doi "https://doi.org/10.1109/icpe.2007.4692407" @default.
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