Matches in SemOpenAlex for { <https://semopenalex.org/work/W2013950089> ?p ?o ?g. }
- W2013950089 endingPage "4130" @default.
- W2013950089 startingPage "4117" @default.
- W2013950089 abstract "Metallic copper, which has low electrical resistivity and high thermal conductivity, is widely used as an interconnector or substrate within microelectronic packages. If a small amount of oxygen is introduced to the surface of the copper, a eutectic liquid forms above 1065 °C. The eutectic liquid wets many ceramics well; it is thus possible to bond slightly oxidized copper to many ceramics directly. The present report summarizes previous results on three systems, Al2O3/Cu, AlN/Cu, and Si3N4/Cu laminates, prepared by the eutectic bonding process. The reported data demonstrate that ceramic/copper interfaces prepared with this technique are strong. Though little attention has been paid to the thermal characteristics of ceramic/copper laminates, the limited data suggest that the thermal conductivity of the laminates is high, the potential for using the laminates for thermal dissipation is thus high. In the present report, the current status for the technique is summarized; critical topics for further improvement are also proposed." @default.
- W2013950089 created "2016-06-24" @default.
- W2013950089 creator A5053532091 @default.
- W2013950089 creator A5054427548 @default.
- W2013950089 date "2014-12-01" @default.
- W2013950089 modified "2023-10-02" @default.
- W2013950089 title "Eutectic bonding of copper to ceramics for thermal dissipation applications – A review" @default.
- W2013950089 cites W1484274632 @default.
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- W2013950089 cites W2059940512 @default.
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- W2013950089 cites W2094782699 @default.
- W2013950089 cites W2104926958 @default.
- W2013950089 cites W2106007588 @default.
- W2013950089 cites W2113809036 @default.
- W2013950089 cites W2117655406 @default.
- W2013950089 cites W2131069711 @default.
- W2013950089 cites W2132090496 @default.
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- W2013950089 cites W2154371853 @default.
- W2013950089 cites W2159600236 @default.
- W2013950089 cites W2160551253 @default.
- W2013950089 cites W2161209559 @default.
- W2013950089 cites W2161891988 @default.
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- W2013950089 cites W4256192658 @default.
- W2013950089 doi "https://doi.org/10.1016/j.jeurceramsoc.2014.07.011" @default.
- W2013950089 hasPublicationYear "2014" @default.
- W2013950089 type Work @default.
- W2013950089 sameAs 2013950089 @default.
- W2013950089 citedByCount "40" @default.
- W2013950089 countsByYear W20139500892015 @default.
- W2013950089 countsByYear W20139500892016 @default.
- W2013950089 countsByYear W20139500892017 @default.
- W2013950089 countsByYear W20139500892018 @default.
- W2013950089 countsByYear W20139500892019 @default.
- W2013950089 countsByYear W20139500892020 @default.
- W2013950089 countsByYear W20139500892021 @default.
- W2013950089 countsByYear W20139500892022 @default.
- W2013950089 countsByYear W20139500892023 @default.
- W2013950089 crossrefType "journal-article" @default.