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• W2014122774 endingPage "80" @default.
• W2014122774 startingPage "75" @default.
• W2014122774 abstract "전자패키징 기술의 발전에 따라 패키지의 소형화는 집적화에 따른 열 소산 면적 감소로 인하여 패키지의 온도 상승을 초래한다. 온도 상승은 소자의 성능을 저해하여, 시스템 고장을 발생을 유발시키며 수명을 단축시킨다. 본 연구에서는 마이크로 패턴과 세미 임베디드 구조를 결합하여 열 소산을 극대화 시킬 수 있는 새로운 구조를 제안하여 열특성을 평가하였다. 제안 구조의 열특성 평가 결과, 기존 구조에 비하여 최대 o온도는 20C낮았으며, 범프의 최대 응력은 20%이상 감소하여 제안 구조의 유효성을 확인하였다. Abstract: According to advance of electronic packaging technology, electronic package becomes smaller. Miniaturizationof package causes the temperature rise of package. This can degrade life of electronic device and generate the failure ofelectronic system. In this study, we proposed a new semi-embedded structure with micro pattern for maximizing heatdissipation. A proposed structure showed the characteristics which have maximum temperature lower than 20" @default.
• W2014122774 created "2016-06-24" @default.
• W2014122774 creator A5048745206 @default.
• W2014122774 creator A5055284888 @default.
• W2014122774 creator A5073671603 @default.
• W2014122774 creator A5074896632 @default.
• W2014122774 date "2013-09-30" @default.
• W2014122774 modified "2023-09-23" @default.
• W2014122774 title "A Study on the Optimization of Heat Dissipation in Flip-chip Package" @default.
• W2014122774 cites W1780575547 @default.
• W2014122774 cites W189271208 @default.
• W2014122774 cites W189605941 @default.
• W2014122774 cites W1985725479 @default.
• W2014122774 cites W2001870828 @default.
• W2014122774 cites W2019171170 @default.
• W2014122774 cites W2031722702 @default.
• W2014122774 cites W2114312288 @default.
• W2014122774 cites W2123529675 @default.
• W2014122774 cites W2125128523 @default.
• W2014122774 cites W2160818085 @default.
• W2014122774 cites W2166800802 @default.
• W2014122774 cites W424962670 @default.
• W2014122774 cites W95125488 @default.
• W2014122774 doi "https://doi.org/10.6117/kmeps.2013.20.3.075" @default.
• W2014122774 hasPublicationYear "2013" @default.
• W2014122774 type Work @default.
• W2014122774 sameAs 2014122774 @default.
• W2014122774 citedByCount "1" @default.
• W2014122774 countsByYear W20141227742019 @default.
• W2014122774 crossrefType "journal-article" @default.
• W2014122774 hasAuthorship W2014122774A5048745206 @default.
• W2014122774 hasAuthorship W2014122774A5055284888 @default.
• W2014122774 hasAuthorship W2014122774A5073671603 @default.
• W2014122774 hasAuthorship W2014122774A5074896632 @default.
• W2014122774 hasBestOaLocation W20141227741 @default.
• W2014122774 hasConcept C114834414 @default.
• W2014122774 hasConcept C121332964 @default.
• W2014122774 hasConcept C126233035 @default.
• W2014122774 hasConcept C127413603 @default.
• W2014122774 hasConcept C135402231 @default.
• W2014122774 hasConcept C159985019 @default.
• W2014122774 hasConcept C160671074 @default.
• W2014122774 hasConcept C162877825 @default.
• W2014122774 hasConcept C165005293 @default.
• W2014122774 hasConcept C165013422 @default.
• W2014122774 hasConcept C184788189 @default.
• W2014122774 hasConcept C186260285 @default.
• W2014122774 hasConcept C192562407 @default.
• W2014122774 hasConcept C199639397 @default.
• W2014122774 hasConcept C24326235 @default.
• W2014122774 hasConcept C2779227376 @default.
• W2014122774 hasConcept C3020349426 @default.
• W2014122774 hasConcept C41008148 @default.
• W2014122774 hasConcept C49040817 @default.
• W2014122774 hasConcept C68928338 @default.
• W2014122774 hasConcept C69567186 @default.
• W2014122774 hasConcept C76155785 @default.
• W2014122774 hasConcept C78519656 @default.
• W2014122774 hasConcept C79072407 @default.
• W2014122774 hasConcept C97355855 @default.
• W2014122774 hasConceptScore W2014122774C114834414 @default.
• W2014122774 hasConceptScore W2014122774C121332964 @default.
• W2014122774 hasConceptScore W2014122774C126233035 @default.
• W2014122774 hasConceptScore W2014122774C127413603 @default.
• W2014122774 hasConceptScore W2014122774C135402231 @default.
• W2014122774 hasConceptScore W2014122774C159985019 @default.
• W2014122774 hasConceptScore W2014122774C160671074 @default.
• W2014122774 hasConceptScore W2014122774C162877825 @default.
• W2014122774 hasConceptScore W2014122774C165005293 @default.
• W2014122774 hasConceptScore W2014122774C165013422 @default.
• W2014122774 hasConceptScore W2014122774C184788189 @default.
• W2014122774 hasConceptScore W2014122774C186260285 @default.
• W2014122774 hasConceptScore W2014122774C192562407 @default.
• W2014122774 hasConceptScore W2014122774C199639397 @default.
• W2014122774 hasConceptScore W2014122774C24326235 @default.
• W2014122774 hasConceptScore W2014122774C2779227376 @default.
• W2014122774 hasConceptScore W2014122774C3020349426 @default.
• W2014122774 hasConceptScore W2014122774C41008148 @default.
• W2014122774 hasConceptScore W2014122774C49040817 @default.
• W2014122774 hasConceptScore W2014122774C68928338 @default.
• W2014122774 hasConceptScore W2014122774C69567186 @default.
• W2014122774 hasConceptScore W2014122774C76155785 @default.
• W2014122774 hasConceptScore W2014122774C78519656 @default.
• W2014122774 hasConceptScore W2014122774C79072407 @default.
• W2014122774 hasConceptScore W2014122774C97355855 @default.
• W2014122774 hasIssue "3" @default.
• W2014122774 hasLocation W20141227741 @default.
• W2014122774 hasOpenAccess W2014122774 @default.
• W2014122774 hasPrimaryLocation W20141227741 @default.
• W2014122774 hasRelatedWork W2045259561 @default.
• W2014122774 hasRelatedWork W2097412897 @default.
• W2014122774 hasRelatedWork W2150956258 @default.
• W2014122774 hasRelatedWork W2327514355 @default.
• W2014122774 hasRelatedWork W2418154415 @default.
• W2014122774 hasRelatedWork W2734859450 @default.
• W2014122774 hasRelatedWork W2759851760 @default.
• W2014122774 hasRelatedWork W2759923735 @default.
• W2014122774 hasRelatedWork W2887946648 @default.

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