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- W2014223603 endingPage "065005" @default.
- W2014223603 startingPage "065005" @default.
- W2014223603 abstract "In this study, we develop mathematical models and numerical simulations of void nucleation and growth induced by the chemical reaction in the flip chip package assembly process using a no-flow underfill. During the thermal assembly process, the underfill chemically reacts to the oxidation of solders I/O on the chip, achieving interconnection between chip and substrate. The chemical reaction causes a large number of voids in the thermal reflow process. The voids have been considered as a critical defect, reducing the life of the thermal reliability. This study investigates the mechanism of void nucleation and growth based on classical bubble nucleation theory and bubble dynamics, respectively. This knowledge can provide a theoretical foundation to achieve a void-free assembly process and high reliability performance." @default.
- W2014223603 created "2016-06-24" @default.
- W2014223603 creator A5020199431 @default.
- W2014223603 creator A5039467339 @default.
- W2014223603 creator A5087845668 @default.
- W2014223603 date "2010-07-09" @default.
- W2014223603 modified "2023-09-25" @default.
- W2014223603 title "A numerical study of void nucleation and growth in a flip chip assembly process" @default.
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- W2014223603 doi "https://doi.org/10.1088/0965-0393/18/6/065005" @default.
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