FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2014365850> ?p ?o ?g. }

• W2014365850 endingPage "2668" @default.
• W2014365850 startingPage "2662" @default.
• W2014365850 abstract "Ni/95Pb-5Sn/Cu ternary diffusion couples were used to investigate the cross-interaction between Ni and Cu across a layer of 95Pb-5Sn solder. High-lead solder layers with a thickness of 100 μm or 400 μm were electroplated over Cu foils. A pure Ni layer (20 μm) was then deposited over the as-deposited high-lead solder surface. The diffusion couples were then aged at 150°C to 250°C for different periods of time. With this technique, the diffusion couples were assembled without experiencing any high-temperature process such as reflow, which would have accelerated the interaction and caused difficulties in analysis. This study revealed that massive spalling also occurred during aging even though reflow was not used. The massive spalling began with the formation of microvoids. When the microvoids had congregated into large enough voids, intermetallic compounds (Cu3Sn) started to spall from the interface. This spalling phenomenon occurred sooner with increasing temperature and decreasing solder volume." @default.
• W2014365850 created "2016-06-24" @default.
• W2014365850 creator A5008627596 @default.
• W2014365850 creator A5015710342 @default.
• W2014365850 creator A5044796911 @default.
• W2014365850 creator A5054159030 @default.
• W2014365850 date "2010-06-02" @default.
• W2014365850 modified "2023-10-16" @default.
• W2014365850 title "Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer" @default.
• W2014365850 cites W1969605924 @default.
• W2014365850 cites W1985243349 @default.
• W2014365850 cites W1996456509 @default.
• W2014365850 cites W1998838980 @default.
• W2014365850 cites W2004895220 @default.
• W2014365850 cites W2007510949 @default.
• W2014365850 cites W2015101381 @default.
• W2014365850 cites W2016092948 @default.
• W2014365850 cites W2018535725 @default.
• W2014365850 cites W2032630978 @default.
• W2014365850 cites W2038796811 @default.
• W2014365850 cites W2044102262 @default.
• W2014365850 cites W2048911256 @default.
• W2014365850 cites W2050031911 @default.
• W2014365850 cites W2050921227 @default.
• W2014365850 cites W2066751832 @default.
• W2014365850 cites W2074650254 @default.
• W2014365850 cites W2075490712 @default.
• W2014365850 cites W2088314224 @default.
• W2014365850 cites W2091065246 @default.
• W2014365850 cites W2113857523 @default.
• W2014365850 cites W2123833062 @default.
• W2014365850 cites W2128133314 @default.
• W2014365850 cites W2136551561 @default.
• W2014365850 cites W2165637712 @default.
• W2014365850 cites W2166792218 @default.
• W2014365850 cites W3011687162 @default.
• W2014365850 doi "https://doi.org/10.1007/s11664-010-1272-7" @default.
• W2014365850 hasPublicationYear "2010" @default.
• W2014365850 type Work @default.
• W2014365850 sameAs 2014365850 @default.
• W2014365850 citedByCount "10" @default.
• W2014365850 countsByYear W20143658502012 @default.
• W2014365850 countsByYear W20143658502014 @default.
• W2014365850 countsByYear W20143658502016 @default.
• W2014365850 countsByYear W20143658502017 @default.
• W2014365850 countsByYear W20143658502018 @default.
• W2014365850 countsByYear W20143658502019 @default.
• W2014365850 crossrefType "journal-article" @default.
• W2014365850 hasAuthorship W2014365850A5008627596 @default.
• W2014365850 hasAuthorship W2014365850A5015710342 @default.
• W2014365850 hasAuthorship W2014365850A5044796911 @default.
• W2014365850 hasAuthorship W2014365850A5054159030 @default.
• W2014365850 hasBestOaLocation W20143658502 @default.
• W2014365850 hasConcept C114793014 @default.
• W2014365850 hasConcept C121332964 @default.
• W2014365850 hasConcept C127313418 @default.
• W2014365850 hasConcept C159985019 @default.
• W2014365850 hasConcept C191897082 @default.
• W2014365850 hasConcept C192562407 @default.
• W2014365850 hasConcept C27501479 @default.
• W2014365850 hasConcept C2777093003 @default.
• W2014365850 hasConcept C2779227376 @default.
• W2014365850 hasConcept C2780026712 @default.
• W2014365850 hasConcept C50296614 @default.
• W2014365850 hasConcept C51807945 @default.
• W2014365850 hasConcept C64355373 @default.
• W2014365850 hasConcept C69357855 @default.
• W2014365850 hasConcept C94709252 @default.
• W2014365850 hasConcept C97355855 @default.
• W2014365850 hasConceptScore W2014365850C114793014 @default.
• W2014365850 hasConceptScore W2014365850C121332964 @default.
• W2014365850 hasConceptScore W2014365850C127313418 @default.
• W2014365850 hasConceptScore W2014365850C159985019 @default.
• W2014365850 hasConceptScore W2014365850C191897082 @default.
• W2014365850 hasConceptScore W2014365850C192562407 @default.
• W2014365850 hasConceptScore W2014365850C27501479 @default.
• W2014365850 hasConceptScore W2014365850C2777093003 @default.
• W2014365850 hasConceptScore W2014365850C2779227376 @default.
• W2014365850 hasConceptScore W2014365850C2780026712 @default.
• W2014365850 hasConceptScore W2014365850C50296614 @default.
• W2014365850 hasConceptScore W2014365850C51807945 @default.
• W2014365850 hasConceptScore W2014365850C64355373 @default.
• W2014365850 hasConceptScore W2014365850C69357855 @default.
• W2014365850 hasConceptScore W2014365850C94709252 @default.
• W2014365850 hasConceptScore W2014365850C97355855 @default.
• W2014365850 hasIssue "12" @default.
• W2014365850 hasLocation W20143658501 @default.
• W2014365850 hasLocation W20143658502 @default.
• W2014365850 hasOpenAccess W2014365850 @default.
• W2014365850 hasPrimaryLocation W20143658501 @default.
• W2014365850 hasRelatedWork W1952038241 @default.
• W2014365850 hasRelatedWork W2003801716 @default.
• W2014365850 hasRelatedWork W2014365850 @default.
• W2014365850 hasRelatedWork W2040445913 @default.
• W2014365850 hasRelatedWork W2099142685 @default.
• W2014365850 hasRelatedWork W2171286266 @default.
• W2014365850 hasRelatedWork W2604393616 @default.
• W2014365850 hasRelatedWork W2982119742 @default.

• next