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- W2014696529 abstract "UV-cured photoresist is applied to the delay masking process to realize a multiple-height microstructure for the first time. Although the UV-cured photoresist is a soft mask, its material property becomes stable against resist thinner and UV exposure. A layered resist pattern can be realized by stacking normal photoresist on the UV-cured photoresist. The UV curing increases the glass transition temperature from 120 to 160 °C. By controlling the temperature, the normal photoresist can be ashed twice as fast as the UV-cured photoresist. This selectivity can be combined with the deep reactive ion etching of Si, and a microstructure having three different etching depths is realized, thus forming a micromirror. The multiple-height structure is advantageous for reducing the inertia of the mirror plate. For the same rotational spring constant, the micromirror has a higher resonant frequency, which is required for realizing higher-resolution laser displays." @default.
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- W2014696529 date "2012-01-01" @default.
- W2014696529 modified "2023-09-27" @default.
- W2014696529 title "Multiple-Height Microstructure Fabricated by Deep Reactive Ion Etching and Selective Ashing of Resist Layer Combined with Ultraviolet Curing" @default.
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- W2014696529 doi "https://doi.org/10.1143/jjap.51.01ab04" @default.
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