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• W2014706908 startingPage "6013" @default.
• W2014706908 abstract "Abstract This study investigates the thermal stability of thermally grown silicon dioxide (thermal SiO 2 ), fluorinated silicate glass (FSG), hydrogen silsesquioxane (HSQ), and organosilicate glass (OSG). Samples with and without sputtered copper films, as-prepared and after annealing at 200 ∼ 800 °C in vacuum, have been investigated by various methods of analysis. For the as-prepared dielectrics, it is found that the densities of HSQ and OSG are less than those of SiO 2 and FSG due to the greater roughness and more porous structure of HSQ and OSG. After annealing at 800 °C, the HSQ structure converts to a SiO 2 -like structure, which is mainly due to decomposition of HSQ. Furthermore, the methyl groups and oxygen atoms are also liberated from OSG after high temperature annealing. A plateau in the Cu profile near the Cu/dielectric interface is observed in the results of secondary ion mass spectrometry after annealing at 450 °C. On the other hand, penetration of Cu atoms across the interface between Cu and HSQ, and across the interface between Cu and OSQ, are observed for Cu/HSQ and Cu/OSG systems after annealing at 450 °C. The thermal stability of these four dielectrics are discussed and compared." @default.
• W2014706908 created "2016-06-24" @default.
• W2014706908 creator A5020766448 @default.
• W2014706908 creator A5047181457 @default.
• W2014706908 date "2008-07-01" @default.
• W2014706908 modified "2023-10-14" @default.
• W2014706908 title "The comparative study of thermal stability among silicon dioxide, fluorinated silicate glass, hydrogen silsesquioxane, and organosilicate glass dielectrics on silicon" @default.
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• W2014706908 doi "https://doi.org/10.1016/j.tsf.2007.10.109" @default.
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