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• W2014715546 abstract "This work focuses on developing a novel convenient method for electroless copper deposition on glass material. This method is relied on the formation of amino (NH2)-terminated film on the surface of glass substrate, by coating polyethylenimine (PEI) on glass matrix and using epichlorohydrin (ECH) as cross-linking agent. The introduced amino groups can effectively adsorb the palladium, the catalysts which could initiate the subsequent Cu electroless plating, onto the glass substrate surface. Finally, a copper film is formed on the palladium-activated glass substrate through copper electroless plating and the surface-coppered glass material is therefore acquired. X-ray diffraction (XRD), atomic force microscope (AFM), scanning electron microscopy (SEM) images combined with energy diffraction X-ray (EDX) analysis demonstrate the successful copper deposition on the surface of glass substrate." @default.
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• W2014715546 date "2011-07-01" @default.
• W2014715546 modified "2023-10-18" @default.
• W2014715546 title "Electroless plating of copper on surface-modified glass substrate" @default.
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• W2014715546 doi "https://doi.org/10.1016/j.apsusc.2011.04.100" @default.
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