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- W2014900891 abstract "The use of printing technologies is promising for low-cost manufacturing of flexible, light-weight and large-area electronics, such as electronic paper or solar cells. Here, we demonstrate a microcutting technique and methods to fabricate cutting blades for the patterning of metal structure on a polymer substrate. Microcutting is done using a hot embossing and nanoimprinting techniques. The metallic fine patterns obtained by using stamps fabricated using different techniques are compared. Combination of microcutting and our recently proposed dielectric alignment opens up a novel platform for a variety of applications, such as the fabrication of metal crossover or organic field effect transistors as well as contact resistance measurement of metal–semiconductor junctions." @default.
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- W2014900891 date "2013-12-09" @default.
- W2014900891 modified "2023-09-26" @default.
- W2014900891 title "Use of microcutting for high throughput electrode patterning on a flexible substrate" @default.
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- W2014900891 doi "https://doi.org/10.1088/0960-1317/24/1/015015" @default.
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