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- W2014953018 abstract "Abstract Advances in microelectronic packaging towards miniaturization and integration require new substrate-testing techniques to be developed. A new electron-beam test system has been built which allows substrates with pads of less than 200 μm in size to be tested. The test sequence and beam positioning are computer controlled using CAD data of the substrate layout. A test of a micropackaging board with 5000 pads requires less than one minute of testing time. The system avoids switching between different primary beam energies, thus yielding high positional accuracy and simple electron optics. A primary energy of 10 keV was found to allow pads of any material to be charged. System performance and practical results are reported. Relevant effects such as insulator charging, microfields, charge retention and random network charging are investigated to secure reliable operation." @default.
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- W2014953018 date "1990-05-01" @default.
- W2014953018 modified "2023-09-27" @default.
- W2014953018 title "CAD-based electron-beam testing of micropackaging boards" @default.
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- W2014953018 doi "https://doi.org/10.1016/0167-9317(90)90039-v" @default.
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