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- W2014975384 abstract "We describe an approach to overlay measurement based upon well-known electrical probe techniques. The advantages realized by our approach are process simplicity, measurement precision of ±0.01μm, independence from imagery and process variations, site-by-site accuracy verification, and the capability of performing many successive overlay evaluations on a single reference wafer. We present the results of overlay performance evaluations of state-of-the-art 1:1 projection printers, including alignment and distortion components and the variable magnification capability.© (1982) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only." @default.
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- W2014975384 date "1982-10-15" @default.
- W2014975384 modified "2023-09-26" @default.
- W2014975384 title "<title>Overlay Characterization Of Projection Aligners Using Electrical Probe Techniques</title>" @default.
- W2014975384 doi "https://doi.org/10.1117/12.933681" @default.
- W2014975384 hasPublicationYear "1982" @default.
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