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- W2014990519 abstract "TeknikCentrum, in cooperation with several companies in Scandinavia andnorthern Europe, is running a 3-year project called 'The Swedish Microsys-tern program'. This program is a cooperative development program betweenvarious companies, the University of Linkoping and the Swedish government.The project was initiated in July 1989.Within the Microsystem program, different kinds of substrates to multi-chip modules are developed, tested and evaluated. The substrates are MultiLayer Ceramics, (MLC), Thick Film, (TF), and Silicon. The different tech-niques will be compared with regard to performance and economics." @default.
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- W2014990519 date "1991-04-01" @default.
- W2014990519 modified "2023-10-18" @default.
- W2014990519 title "<title>Silicon-on-silicon microsystem in plastic packages</title>" @default.
- W2014990519 doi "https://doi.org/10.1117/12.47720" @default.
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