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- W2015121594 abstract "This paper describes the features and state-of-the-art of process and device technologies of three-dimensional ICs. Various kinds of application proposals of three-dimensional structures are also presented and discussed. One of the most promising application areas in future is believed to be image sensing and processing. The SOI and some other new technologies are applied for fabricating the functional model of an intelligent image processor with a three layer structure, resulting in a new synthetic operation consisting of light sensing, quantization, and signal processing. The capabilities of multi-functional operation and the parallel processing verified in this miniature system give a clear image of the future of three-dimensional ICs." @default.
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- W2015121594 title "Three-dimensional integrated circuit: technology and application prospect" @default.
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- W2015121594 doi "https://doi.org/10.1016/0026-2692(89)90125-0" @default.
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