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• W2015439706 endingPage "418" @default.
• W2015439706 startingPage "409" @default.
• W2015439706 abstract "Add-on process modules as enhancements for standard high-frequency silicon integration processes are discussed. Such modules can cost-effectively be added without any interference with the core process before (pre-process modules), during (mid-process modules), or after (post-process modules) the circuit integration. In addition, layout options providing a most cost-effective means of enhancement are discussed. High-resistivity silicon substrates, ferromagnetic thin-film integration, bulk micromachining, saddle-add-on metallization, spacer-substrate integration, and metal layer shunting are presented as examples in those categories." @default.
• W2015439706 created "2016-06-24" @default.
• W2015439706 creator A5074267030 @default.
• W2015439706 date "2005-03-01" @default.
• W2015439706 modified "2023-10-18" @default.
• W2015439706 title "Review of add-on process modules for high-frequency silicon technology" @default.
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• W2015439706 doi "https://doi.org/10.1016/j.microrel.2004.12.002" @default.
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