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- W2015625399 abstract "Abstract Cu(Ti 27 at.%) alloy and Cu(90 nm)/Ti(20 nm) bilayer films were deposited on thermally grown silicon-dioxide and dealloyed under thermal treatment at temperatures 400–700 °C for 30 min in an ammonia ambient. During annealing Ti segregated to both the free surface and the alloy/SiO 2 interface. At the interface the Ti dissociated the SiO 2 and reacted with the freed Si and O to form a TiO/Ti 5 Si 3 structure. High-resolution energy dispersive X-ray technique revealed the presence of interfacial copper between the Ti-silicide and Ti-oxide layers. The interfacial copper did not reduce the reaction temperature. Nevertheless it was associated with the enhanced dissociation of SiO 2 . The data suggested that in the presence of the interfacial copper, the rate of oxide consumption is increased by a factor of 3 to 4. The enhancement of the oxide consumption was observed at temperatures between 450 and 600 °C. It is believed that the higher reaction rate is due to a catalytic effect exhibited by the interfacial Cu when it exists in the form of Cu 2 O." @default.
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- W2015625399 date "1996-11-01" @default.
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- W2015625399 title "Influence of interfacial copper during the dealloying and nitridation of Cu-Ti films" @default.
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- W2015625399 doi "https://doi.org/10.1016/s0254-0584(96)01806-8" @default.
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