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- W2016102725 abstract "Over the past year, the pattern in assembly of electronics components to printed circuit boards (PCBs) has changed dramatically, with far greater use of surface mounted devices (SMDs) in place of through‐hole insertion of leaded devices. Therefore, most of the established makers of machinery have introduced special placement equipment. However, the Japanese were slow to introduce the vapour phase soldering needed for surface mounting, but now equipment, claimed to overcome the weaknesses of the early machines, is available." @default.
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- W2016102725 date "1987-02-01" @default.
- W2016102725 modified "2023-09-24" @default.
- W2016102725 title "Surface mounting spurs automation" @default.
- W2016102725 doi "https://doi.org/10.1108/eb004213" @default.
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