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• W2016579722 abstract "Electrodeposition of Cu–Ni thin films can result in phase separation characterized by the formation of nodular features that exhibit a uniform columnar core/shell structure with a copper-rich core and nickel-rich shell. Here, we show that the core/shell microstructure is the result of differences in the nucleation and growth rates of the two components. In the potential range where the core/shell structure is observed, copper deposition is fast, resulting in the formation of a relatively low density of large hemispherical islands. Nickel deposition is characterized by slower kinetics, resulting in the formation of a high density of small islands surrounding the copper islands. These results provide a basis for understanding the formation of this core/shell microstructure in binary alloy systems." @default.
• W2016579722 created "2016-06-24" @default.
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• W2016579722 date "2008-01-01" @default.
• W2016579722 modified "2023-10-11" @default.
• W2016579722 title "Formation of a Core/Shell Microstructure in Cu–Ni Thin Films" @default.
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• W2016579722 doi "https://doi.org/10.1149/1.2946709" @default.
• W2016579722 hasPublicationYear "2008" @default.
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