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- W2016669735 abstract "Silver (Ag) films have been the noble-metal choice in nanophotonics for different innovative applications. This work shows a simple and effective way to achieve atomically smooth, continuous Ag films (<; 10 nm) with the use of Cu (1 nm) seed layer. Compared to previous reports on Ge/Ag films, the use of Cu as seed layer material improves the surface roughness of Ag films (with RMS roughness <; 5A over 10 μm x 10 μm area) and reduces the electrical resistivity by more than a factor of 2. In addition, due to the lower percolation thickness, the minimum thickness required to obtain a continuous Ag film down to 3 nm, which is much lower than reported in literature for Ag films, is produced." @default.
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- W2016669735 date "2013-05-01" @default.
- W2016669735 modified "2023-10-09" @default.
- W2016669735 title "Oxidation-free and ultra-smooth thin silver films grown on a copper seed layer" @default.
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- W2016669735 doi "https://doi.org/10.1109/cleoe-iqec.2013.6800940" @default.
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