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- W2016769424 abstract "In order to improve the interface wettability between the SiCp and Cu materials, the chemical plating and hot pressing sintering technique were utilized to prepare the SiCp/Cu composites. The morphology of the SiC powder before and after chemical plating was studied and the micro-structure of hot-pressed sintered SiCp/Cu composites was investigated in details. The results showed that the finer SiC powder could improve the wear resistance ability of the SiCp/Cu composites obviously. The worn rate reduced with the size of the SiC powder increasing under the same load." @default.
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- W2016769424 date "2013-06-01" @default.
- W2016769424 modified "2023-10-18" @default.
- W2016769424 title "The Micro-Structure and Wear Behavior of the SiCp/Cu Composites before and after Chemical Plating" @default.
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- W2016769424 doi "https://doi.org/10.4028/www.scientific.net/amr.706-708.344" @default.
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