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- W2016996865 abstract "X-ray photoelectron spectroscopy has been used to follow the chemistry occuring at the surface of PMDA-ODA polyimide during thermal deposition and ion-sputtering of Cu. At low coverages, Cu has been found to selectively react with the carbonyl groups of the PMDA unit to form Cu+-O--C linkages. The Cu+ valence state manifests itself in the CuLMM spectra as a distinct feature shifted by ∼2 eV from the main peak to lower kinetic energy. Compared to thermal deposition, ion-sputtering of Cu results in more severe chemical changes at the polyimide surface, indicating a partial destruction of the polymer surface layers." @default.
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- W2016996865 title "An XPS study of the in-situ formation of the polyimide/copper interface" @default.
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