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- W2017052401 abstract "The interdiffusion between an electroless NiP deposit and liquid solder was investigated with the aid of an X-ray diffractometer and a scanning electron microscope to identify the intermetallic compounds formed. Sn was found to be the dominant diffusing atom in the interdiffusion process according to analysis by Auger electron spectroscopy. The intermetallic compounds Ni 3 Sn 4 and Ni 3 Sn 2 were formed between NiP and the solder in which phosphorus was also detected. The kinetics of the formation of intermetallic compounds and the activation energy for the diffusion of Sn were investigated." @default.
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- W2017052401 title "The interaction kinetics and compound formation between electroless NiP and solder" @default.
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- W2017052401 doi "https://doi.org/10.1016/0040-6090(94)90761-7" @default.
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