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• W2017164482 abstract "An advanced 3D integration process featuring through silicon via (TSV) and chip-on-wafer (CoW) technologies has been demonstrated. Using this 3D process, Poly and High-K/Metal Gate (HKMG) CMOS wafers have been successfully thinned and stacked, showing little to no degradation in the process. The effect of TSV induced mechanical stress on ΔIdsat for HKMG is found to be smaller as compared to Poly Gate devices for the same channel length (ΔIdsat ratio of HKMG to Poly is ~0.3 and ~0.5 for PMOS and NMOS, respectively). In addition, we show that ΔIdsat for HKMG device is proportional to TSV diameter square, independent of TSV orientation, device polarity, and device distance from TSV." @default.
• W2017164482 created "2016-06-24" @default.
• W2017164482 creator A5002772048 @default.
• W2017164482 creator A5006677935 @default.
• W2017164482 creator A5022982695 @default.
• W2017164482 creator A5023321778 @default.
• W2017164482 creator A5050762000 @default.
• W2017164482 creator A5065633162 @default.
• W2017164482 creator A5068934748 @default.
• W2017164482 creator A5069947291 @default.
• W2017164482 creator A5073417034 @default.
• W2017164482 creator A5078935095 @default.
• W2017164482 creator A5080749970 @default.
• W2017164482 creator A5089429689 @default.
• W2017164482 creator A5090984260 @default.
• W2017164482 date "2012-12-01" @default.
• W2017164482 modified "2023-10-14" @default.
• W2017164482 title "Thinning, stacking, and TSV proximity effects for Poly and High-K/Metal Gate CMOS devices in an advanced 3D integration process" @default.
• W2017164482 cites W2120106678 @default.
• W2017164482 cites W2129426325 @default.
• W2017164482 cites W2141361504 @default.
• W2017164482 cites W2151287973 @default.
• W2017164482 doi "https://doi.org/10.1109/iedm.2012.6479158" @default.
• W2017164482 hasPublicationYear "2012" @default.
• W2017164482 type Work @default.
• W2017164482 sameAs 2017164482 @default.
• W2017164482 citedByCount "11" @default.
• W2017164482 countsByYear W20171644822013 @default.
• W2017164482 countsByYear W20171644822014 @default.
• W2017164482 countsByYear W20171644822015 @default.
• W2017164482 countsByYear W20171644822017 @default.
• W2017164482 countsByYear W20171644822019 @default.
• W2017164482 countsByYear W20171644822020 @default.
• W2017164482 crossrefType "proceedings-article" @default.
• W2017164482 hasAuthorship W2017164482A5002772048 @default.
• W2017164482 hasAuthorship W2017164482A5006677935 @default.
• W2017164482 hasAuthorship W2017164482A5022982695 @default.
• W2017164482 hasAuthorship W2017164482A5023321778 @default.
• W2017164482 hasAuthorship W2017164482A5050762000 @default.
• W2017164482 hasAuthorship W2017164482A5065633162 @default.
• W2017164482 hasAuthorship W2017164482A5068934748 @default.
• W2017164482 hasAuthorship W2017164482A5069947291 @default.
• W2017164482 hasAuthorship W2017164482A5073417034 @default.
• W2017164482 hasAuthorship W2017164482A5078935095 @default.
• W2017164482 hasAuthorship W2017164482A5080749970 @default.
• W2017164482 hasAuthorship W2017164482A5089429689 @default.
• W2017164482 hasAuthorship W2017164482A5090984260 @default.
• W2017164482 hasConcept C119599485 @default.
• W2017164482 hasConcept C127413603 @default.
• W2017164482 hasConcept C131017901 @default.
• W2017164482 hasConcept C160671074 @default.
• W2017164482 hasConcept C165801399 @default.
• W2017164482 hasConcept C172385210 @default.
• W2017164482 hasConcept C178790620 @default.
• W2017164482 hasConcept C185592680 @default.
• W2017164482 hasConcept C192562407 @default.
• W2017164482 hasConcept C197162436 @default.
• W2017164482 hasConcept C2361726 @default.
• W2017164482 hasConcept C24326235 @default.
• W2017164482 hasConcept C27050352 @default.
• W2017164482 hasConcept C2778413303 @default.
• W2017164482 hasConcept C33347731 @default.
• W2017164482 hasConcept C45632049 @default.
• W2017164482 hasConcept C46362747 @default.
• W2017164482 hasConcept C49040817 @default.
• W2017164482 hasConcept C51140833 @default.
• W2017164482 hasConceptScore W2017164482C119599485 @default.
• W2017164482 hasConceptScore W2017164482C127413603 @default.
• W2017164482 hasConceptScore W2017164482C131017901 @default.
• W2017164482 hasConceptScore W2017164482C160671074 @default.
• W2017164482 hasConceptScore W2017164482C165801399 @default.
• W2017164482 hasConceptScore W2017164482C172385210 @default.
• W2017164482 hasConceptScore W2017164482C178790620 @default.
• W2017164482 hasConceptScore W2017164482C185592680 @default.
• W2017164482 hasConceptScore W2017164482C192562407 @default.
• W2017164482 hasConceptScore W2017164482C197162436 @default.
• W2017164482 hasConceptScore W2017164482C2361726 @default.
• W2017164482 hasConceptScore W2017164482C24326235 @default.
• W2017164482 hasConceptScore W2017164482C27050352 @default.
• W2017164482 hasConceptScore W2017164482C2778413303 @default.
• W2017164482 hasConceptScore W2017164482C33347731 @default.
• W2017164482 hasConceptScore W2017164482C45632049 @default.
• W2017164482 hasConceptScore W2017164482C46362747 @default.
• W2017164482 hasConceptScore W2017164482C49040817 @default.
• W2017164482 hasConceptScore W2017164482C51140833 @default.
• W2017164482 hasLocation W20171644821 @default.
• W2017164482 hasOpenAccess W2017164482 @default.
• W2017164482 hasPrimaryLocation W20171644821 @default.
• W2017164482 hasRelatedWork W1499398507 @default.
• W2017164482 hasRelatedWork W1592534261 @default.
• W2017164482 hasRelatedWork W1742453416 @default.
• W2017164482 hasRelatedWork W1988615533 @default.
• W2017164482 hasRelatedWork W2082944690 @default.
• W2017164482 hasRelatedWork W2103234243 @default.
• W2017164482 hasRelatedWork W2128795533 @default.
• W2017164482 hasRelatedWork W2167827630 @default.
• W2017164482 hasRelatedWork W2170401555 @default.
• W2017164482 hasRelatedWork W4386261925 @default.
• W2017164482 isParatext "false" @default.
• W2017164482 isRetracted "false" @default.

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