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• W2017221878 abstract "Ultrathin films were fabricated using synthesized hydroxyl polyimide (HPI) in a layer-by-layer fashion on amine-terminated substrates of silicon, quartz, and gold. The interlayer linkages were established by using terephthaloyl chloride as a bridging agent to form ester groups between HPI layers. Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, UV-vis absorption spectroscopy, atomic force microscopy, ellipsometry, and electrochemical impedance spectroscopy were employed to study the interfacial chemistry, stepwise growth, morphology, thickness, optical property, and insulation behavior of the assembled film. The films show excellent stability and strength, which can be attributed to the covalent interlayer linkage." @default.
• W2017221878 created "2016-06-24" @default.
• W2017221878 creator A5006017380 @default.
• W2017221878 creator A5056283764 @default.
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• W2017221878 date "2005-03-11" @default.
• W2017221878 modified "2023-09-25" @default.
• W2017221878 title "Application of Direct Covalent Molecular Assembly in the Fabrication of Polyimide Ultrathin Films" @default.
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• W2017221878 doi "https://doi.org/10.1021/la048741r" @default.
• W2017221878 hasPubMedId "https://pubmed.ncbi.nlm.nih.gov/15807578" @default.
• W2017221878 hasPublicationYear "2005" @default.
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