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- W2017245818 abstract "This paper will evaluate the potential improvements with the addition of an aqueous based top antireflective coating to a Deep-UV process. This antireflective coating (ARC) is resistant to intermixing with the resists and is removed during the normal develop operation. A logic IC with 0.15- 0.18 micrometers design rules will be the primary test vehicle, concentrating on Contact/VIA levels. Performance will be compare with and without the top ARC. Uniformity of measured critical dimensions (CD) will be compared. CD/dose swing curve suppression, as a function of substrate and resist thickness, will be documented. The Deep-UV resist/top ARC application will be optimized, as well, to maximize throughput." @default.
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- W2017245818 date "1999-06-11" @default.
- W2017245818 modified "2023-09-23" @default.
- W2017245818 title "Top antireflective coating process for deep-UV lithography" @default.
- W2017245818 doi "https://doi.org/10.1117/12.350147" @default.
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