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• W2017394047 abstract "LEDs are being utilized as lighting source due to its superior advantages over incandescent lamps in terms of higher efficiency, brighter light emission and longer lifetime. However, the reliability and efficiency of the LED is dependent on the junction temperature of the LED chip. Hence, the heat dissipation of single chip LED package with aluminum heat slug was investigated through simulation in this study .The heat dissipation was evaluated in terms of junction temperature. The single chip LED was powered with input power of 0.1W and 1W. The Von Mises stress of the LED chip at both input power was evaluated. The maximum junction temperature of the LED at steady state is 119.43°C at input power of 1W." @default.
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• W2017394047 date "2013-04-01" @default.
• W2017394047 modified "2023-09-25" @default.
• W2017394047 title "Solid State Lighting Stress and Junction Temperature Evaluation on Operating Power" @default.
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• W2017394047 doi "https://doi.org/10.1109/uksim.2013.127" @default.
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