Matches in SemOpenAlex for { <https://semopenalex.org/work/W2017557174> ?p ?o ?g. }
Showing items 1 to 82 of
82
with 100 items per page.
- W2017557174 abstract "The SU-8 negative photo resist has been recognised as an unique resist, equally useful for UV lithography and deep x-ray lithography (DXRL) applications; but it is in DXRL where SU-8 has shown a significant advantage over other resists. When compared with the common DXRL resist poly-methyl methacrylate (PMMA), SU-8 has been found to significantly reduce x-ray exposure time, processing time and cost, thus making SU-8 a strong candidate for commercial DXRL applications. Despite these advantages, several factors associated with SU-8 processing are not well understood. Resist-substrate adhesion, which is the key for successful lithography, is one such example. This paper examines the effect of substrate (silicon and graphite), seed layer (Ti/Cu/Ti, Ti/Cu, Cr/Au and Cr/Au/Cr), and the use of adhesion promoters (OmniCoat and MPTS) on the adhesion of SU-8 structures. In addition, parameters such as SU-8 thickness (450 μm, 650 μm, 900 μm) and substrate roughness values (silicon, Ra < 10 nm and Ra = 0.5 μm) have also been investigated. The results of our work highlight the importance of material selection for a given process and the relationship between the different parameters investigated. Increased stress for thicker films (> 850 μm) has lead to the delamination of SU-8 on some substrates. The adhesion has also proven to be a function of process parameters such as pre-bake (time and temperature), exposure dose, development time and post exposure bake (time and temperature). We have found that a <100> silicon wafer (Ra = 0.5 μm) containing a titanium-copper-titanium (Ti/Cu/Ti) seed layer, provided an adequately adhered resist for DXRL, while a chromium-gold (Cr/Au) seed layer on silicon (Ra = 0.5 μm) showed poor adhesion. A detailed correlation of the effect of these parameters on SU-8 adhesion will be discussed in this paper." @default.
- W2017557174 created "2016-06-24" @default.
- W2017557174 creator A5010053257 @default.
- W2017557174 creator A5023322008 @default.
- W2017557174 creator A5035052628 @default.
- W2017557174 creator A5049769364 @default.
- W2017557174 creator A5055977869 @default.
- W2017557174 date "2004-04-02" @default.
- W2017557174 modified "2023-09-23" @default.
- W2017557174 title "An investigation of SU-8 resist adhesion in deep x-ray lithography of high-aspect-ratio structures" @default.
- W2017557174 doi "https://doi.org/10.1117/12.521170" @default.
- W2017557174 hasPublicationYear "2004" @default.
- W2017557174 type Work @default.
- W2017557174 sameAs 2017557174 @default.
- W2017557174 citedByCount "12" @default.
- W2017557174 countsByYear W20175571742012 @default.
- W2017557174 countsByYear W20175571742015 @default.
- W2017557174 crossrefType "proceedings-article" @default.
- W2017557174 hasAuthorship W2017557174A5010053257 @default.
- W2017557174 hasAuthorship W2017557174A5023322008 @default.
- W2017557174 hasAuthorship W2017557174A5035052628 @default.
- W2017557174 hasAuthorship W2017557174A5049769364 @default.
- W2017557174 hasAuthorship W2017557174A5055977869 @default.
- W2017557174 hasConcept C111368507 @default.
- W2017557174 hasConcept C127313418 @default.
- W2017557174 hasConcept C134406635 @default.
- W2017557174 hasConcept C151730666 @default.
- W2017557174 hasConcept C159985019 @default.
- W2017557174 hasConcept C163581340 @default.
- W2017557174 hasConcept C171250308 @default.
- W2017557174 hasConcept C192562407 @default.
- W2017557174 hasConcept C200274948 @default.
- W2017557174 hasConcept C204223013 @default.
- W2017557174 hasConcept C2777289219 @default.
- W2017557174 hasConcept C2779227376 @default.
- W2017557174 hasConcept C30239060 @default.
- W2017557174 hasConcept C41794268 @default.
- W2017557174 hasConcept C49040817 @default.
- W2017557174 hasConcept C53524968 @default.
- W2017557174 hasConcept C544956773 @default.
- W2017557174 hasConcept C58097730 @default.
- W2017557174 hasConcept C77928131 @default.
- W2017557174 hasConcept C84416704 @default.
- W2017557174 hasConcept C86803240 @default.
- W2017557174 hasConceptScore W2017557174C111368507 @default.
- W2017557174 hasConceptScore W2017557174C127313418 @default.
- W2017557174 hasConceptScore W2017557174C134406635 @default.
- W2017557174 hasConceptScore W2017557174C151730666 @default.
- W2017557174 hasConceptScore W2017557174C159985019 @default.
- W2017557174 hasConceptScore W2017557174C163581340 @default.
- W2017557174 hasConceptScore W2017557174C171250308 @default.
- W2017557174 hasConceptScore W2017557174C192562407 @default.
- W2017557174 hasConceptScore W2017557174C200274948 @default.
- W2017557174 hasConceptScore W2017557174C204223013 @default.
- W2017557174 hasConceptScore W2017557174C2777289219 @default.
- W2017557174 hasConceptScore W2017557174C2779227376 @default.
- W2017557174 hasConceptScore W2017557174C30239060 @default.
- W2017557174 hasConceptScore W2017557174C41794268 @default.
- W2017557174 hasConceptScore W2017557174C49040817 @default.
- W2017557174 hasConceptScore W2017557174C53524968 @default.
- W2017557174 hasConceptScore W2017557174C544956773 @default.
- W2017557174 hasConceptScore W2017557174C58097730 @default.
- W2017557174 hasConceptScore W2017557174C77928131 @default.
- W2017557174 hasConceptScore W2017557174C84416704 @default.
- W2017557174 hasConceptScore W2017557174C86803240 @default.
- W2017557174 hasLocation W20175571741 @default.
- W2017557174 hasOpenAccess W2017557174 @default.
- W2017557174 hasPrimaryLocation W20175571741 @default.
- W2017557174 hasRelatedWork W1565437664 @default.
- W2017557174 hasRelatedWork W1618604960 @default.
- W2017557174 hasRelatedWork W1974313763 @default.
- W2017557174 hasRelatedWork W1986397372 @default.
- W2017557174 hasRelatedWork W2030781314 @default.
- W2017557174 hasRelatedWork W2149151706 @default.
- W2017557174 hasRelatedWork W2370273439 @default.
- W2017557174 hasRelatedWork W3091884080 @default.
- W2017557174 hasRelatedWork W3098516669 @default.
- W2017557174 hasRelatedWork W2470968409 @default.
- W2017557174 isParatext "false" @default.
- W2017557174 isRetracted "false" @default.
- W2017557174 magId "2017557174" @default.
- W2017557174 workType "article" @default.