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• W2017619982 abstract "In 3D VLSI, through-silicon vias (TSVs) are relatively large, and closely spaced. This results in a situation in which noise on one or more TSVs may deteriorate the delay and signal integrity of neighboring TSVs. In this paper, we first quantify the parasitics in contemporary TSVs, and then come up with a classification of crosstalk sequences as OC, 1C,... 8C sequences. Next, we present inductive approaches to quantify the exact overhead for 8C, 6C and 4C crosstalk avoidance codes (CACs) for a 3 x n mesh arrangement of TSVs. These overheads for different CACs for a 3 x n mesh arrangement of TSVs are used to calculate the lower bounds on the corresponding overheads for an n x n mesh arrangements of TSVs. We also discuss an efficient way to implement the coding and decoding (CODEC) circuitry for limiting the maximum crosstalk to 6C. Our experimental results show that for a TSV mesh arrangement driven by inverters implemented in a 22nm technology, the coding based approaches yields improvements which are in line with the theoretical predictions." @default.
• W2017619982 created "2016-06-24" @default.
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• W2017619982 date "2013-03-18" @default.
• W2017619982 modified "2023-09-23" @default.
• W2017619982 title "Crosstalk avoidance codes for 3D VLSI" @default.
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• W2017619982 doi "https://doi.org/10.5555/2485288.2485684" @default.
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