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- W2018170931 abstract "Electrical interconnection on printed circuit boards and other peripheral technologies cannot keep up with decreasing interconnection dimensions and increasing driving clock speed in LSI technology, so that system performance is degraded. This “I/O bottleneck problem” has been recognized as a serious threat in the near future. Optical interconnection has drawn attention as a breakthrough technology to resolve this problem. The authors have been engaged in development of optical interconnection technologies that are capable of providing high-speed and large-capacity bus lines connecting spatially separated LSI chips on a printed circuit board. This paper explains the photonic circuit configuration and element technologies for interchip optical interconnection by means of a planar photonic substrate with diffractive optical devices and LSI chips integrated with optical devices. The experimental results obtained to date are introduced. © 2002 Wiley Periodicals, Inc. Electron Comm Jpn Pt 2, 86(1): 9–17, 2003; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/ecjb.10024" @default.
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- W2018170931 date "2002-12-13" @default.
- W2018170931 modified "2023-09-25" @default.
- W2018170931 title "Interchip optical interconnection using planar-type photonic circuit and optoelectronic integrated devices" @default.
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- W2018170931 doi "https://doi.org/10.1002/ecjb.10024" @default.
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