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- W2018704639 abstract "A potential technology by substrate interposer enables high bandwidth and low power application processing devices of the future, because the demand of smart mobile products are driving for higher logic-to-memory bandwidth (BW) over 30 GB/s with lower power consumption and ultra-capacity of memory. This paper presents a new High Bandwidth Package-on-Package (HB-PoP) structure with substrate interposer to support 2-channel 64-bit LPDDR3 memory and demonstrate electrical performances including signal integrity (SI) and power integrity (PI). In addition, the thermal performance and warpage behavior of HB-PoPs structures are also better than conventional PoP. Utilizing the structures proposed by Advance Semiconductor Engineering (ASE) Inc., the package of Wide-IO memory can be realized by them as well." @default.
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- W2018704639 date "2014-05-01" @default.
- W2018704639 modified "2023-10-12" @default.
- W2018704639 title "Next generation package-on-package solution to support wide IO and high bandwidth interface" @default.
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- W2018704639 doi "https://doi.org/10.1109/ectc.2014.6897594" @default.
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