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- W2018902005 abstract "The emergence of wearable electronics is leading away form glass substrates for the display backplane, to plastic and metal. At the same time the substrate thickness is reduced to make displays lighter. These two trends cooperate toward the development of compliant substrates, which are designed to off load mechanical stress from the active circuit onto the substrate. Compliant substrates made the circuit particularly rugged against rolling and bending. Design principles for compliant substrates include: (a) Moving the circuit p;lane as close as possible to the neutral plane of the structure, and (b) Using substrate and encapsulation materials with low stiffness. Design principle (a) is demonstrated on thin-film transistors made on thin steel foil. Such transistors function well after the foils are rolled to small radii of curvature. Principle (b) of compliant substrates is demonstrated with bending experiments of a-Si:H TFTs made on thin substrates of polyimide foil. TFTs on 25-micrometers thick polyimide foil may be bent to radii of curvature as low as 0.5 mm without failing. The reduction in bending radius, from R-2 mm on same- thickness steel foil, agrees with the theoretical prediction that changing from a stiff to a compliant substrate reduces the bending strain in the device plane by a factor of up to 5." @default.
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- W2018902005 date "1999-04-12" @default.
- W2018902005 modified "2023-09-22" @default.
- W2018902005 title "<title>Compliant substrates for thin-film transistor backplanes</title>" @default.
- W2018902005 doi "https://doi.org/10.1117/12.344653" @default.
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