FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2019211897> ?p ?o ?g. }

• W2019211897 endingPage "1142" @default.
• W2019211897 startingPage "1131" @default.
• W2019211897 abstract "Reliability performance of IC packages during drop impact is critical, especially for handheld electronic products. Currently, there is no model that provides good correlation with experimental measurements of acceleration and impact life. In this paper, detailed drop tests and simulations are performed on TFBGA (thin-profile fine-pitch BGA) and VFBGA (very-thin-profile fine-pitch BGA) packages at board level using testing procedures developed in-house. The packages are susceptible to solder joint failures, induced by a combination of PCB bending and mechanical shock during impact. The critical solder ball is observed to occur at the outermost corner solder joint, and fails along the solder and PCB pad interface. Various testing parameters are studied experimentally and analytically, to understand the effects of drop height, drop orientation, number of PCB mounting screws to fixture, position of component on board, PCB bending, solder material, etc. Drop height, felt thickness, and contact conditions are used to fine-tune the shape and level of shock pulse required. Board level drop test can be better controlled, compared with system or product level test such as impact of mobile phone, which sometimes has rather unpredictable results due to higher complexity and variations in drop orientation. At the same time, dynamic simulation is performed to compare with experimental results. The model established has close values of peak acceleration and impact duration as measured in actual drop test. The failure mode and critical solder ball location predicted by modeling correlate well with testing. For the first time, an accurate life prediction model is proposed for board level drop test to estimate the number of drops to failure for a package. For the correlation cases studied, the maximum normal peeling stresses of critical solder joints correlate well with the mean impact lives measured during the drop test. The uncertainty of impact life prediction is within ±4 drops, for a typical test of 50 drops. With this new model, a failure-free state can be determined, and drop test performance of new package design can be quantified, and further enhanced through modeling. This quantitative approach is different from traditional qualitative modeling, as it provides both accurate relative and absolute impact life prediction. The relative performance of package may be different under board level drop test and thermal cycling test. Different design guidelines should be considered, depending on application and area of concern." @default.
• W2019211897 created "2016-06-24" @default.
• W2019211897 creator A5020540772 @default.
• W2019211897 creator A5031498697 @default.
• W2019211897 creator A5032563301 @default.
• W2019211897 creator A5056599169 @default.
• W2019211897 creator A5083982010 @default.
• W2019211897 date "2004-07-01" @default.
• W2019211897 modified "2023-09-26" @default.
• W2019211897 title "Impact life prediction modeling of TFBGA packages under board level drop test" @default.
• W2019211897 cites W1750993373 @default.
• W2019211897 cites W2012019750 @default.
• W2019211897 cites W2059810627 @default.
• W2019211897 cites W2123676920 @default.
• W2019211897 cites W2124770006 @default.
• W2019211897 cites W2151899654 @default.
• W2019211897 cites W2153884005 @default.
• W2019211897 doi "https://doi.org/10.1016/j.microrel.2004.03.005" @default.
• W2019211897 hasPublicationYear "2004" @default.
• W2019211897 type Work @default.
• W2019211897 sameAs 2019211897 @default.
• W2019211897 citedByCount "183" @default.
• W2019211897 countsByYear W20192118972012 @default.
• W2019211897 countsByYear W20192118972013 @default.
• W2019211897 countsByYear W20192118972014 @default.
• W2019211897 countsByYear W20192118972015 @default.
• W2019211897 countsByYear W20192118972016 @default.
• W2019211897 countsByYear W20192118972017 @default.
• W2019211897 countsByYear W20192118972018 @default.
• W2019211897 countsByYear W20192118972019 @default.
• W2019211897 countsByYear W20192118972020 @default.
• W2019211897 countsByYear W20192118972021 @default.
• W2019211897 countsByYear W20192118972022 @default.
• W2019211897 crossrefType "journal-article" @default.
• W2019211897 hasAuthorship W2019211897A5020540772 @default.
• W2019211897 hasAuthorship W2019211897A5031498697 @default.
• W2019211897 hasAuthorship W2019211897A5032563301 @default.
• W2019211897 hasAuthorship W2019211897A5056599169 @default.
• W2019211897 hasAuthorship W2019211897A5083982010 @default.
• W2019211897 hasConcept C119599485 @default.
• W2019211897 hasConcept C120793396 @default.
• W2019211897 hasConcept C122041747 @default.
• W2019211897 hasConcept C126233035 @default.
• W2019211897 hasConcept C127413603 @default.
• W2019211897 hasConcept C134306372 @default.
• W2019211897 hasConcept C159985019 @default.
• W2019211897 hasConcept C160671074 @default.
• W2019211897 hasConcept C171250308 @default.
• W2019211897 hasConcept C192562407 @default.
• W2019211897 hasConcept C2775865969 @default.
• W2019211897 hasConcept C2776584680 @default.
• W2019211897 hasConcept C2778502540 @default.
• W2019211897 hasConcept C2780483431 @default.
• W2019211897 hasConcept C2780644530 @default.
• W2019211897 hasConcept C2781122048 @default.
• W2019211897 hasConcept C2781345722 @default.
• W2019211897 hasConcept C33923547 @default.
• W2019211897 hasConcept C50296614 @default.
• W2019211897 hasConcept C66938386 @default.
• W2019211897 hasConcept C78519656 @default.
• W2019211897 hasConcept C94709252 @default.
• W2019211897 hasConceptScore W2019211897C119599485 @default.
• W2019211897 hasConceptScore W2019211897C120793396 @default.
• W2019211897 hasConceptScore W2019211897C122041747 @default.
• W2019211897 hasConceptScore W2019211897C126233035 @default.
• W2019211897 hasConceptScore W2019211897C127413603 @default.
• W2019211897 hasConceptScore W2019211897C134306372 @default.
• W2019211897 hasConceptScore W2019211897C159985019 @default.
• W2019211897 hasConceptScore W2019211897C160671074 @default.
• W2019211897 hasConceptScore W2019211897C171250308 @default.
• W2019211897 hasConceptScore W2019211897C192562407 @default.
• W2019211897 hasConceptScore W2019211897C2775865969 @default.
• W2019211897 hasConceptScore W2019211897C2776584680 @default.
• W2019211897 hasConceptScore W2019211897C2778502540 @default.
• W2019211897 hasConceptScore W2019211897C2780483431 @default.
• W2019211897 hasConceptScore W2019211897C2780644530 @default.
• W2019211897 hasConceptScore W2019211897C2781122048 @default.
• W2019211897 hasConceptScore W2019211897C2781345722 @default.
• W2019211897 hasConceptScore W2019211897C33923547 @default.
• W2019211897 hasConceptScore W2019211897C50296614 @default.
• W2019211897 hasConceptScore W2019211897C66938386 @default.
• W2019211897 hasConceptScore W2019211897C78519656 @default.
• W2019211897 hasConceptScore W2019211897C94709252 @default.
• W2019211897 hasIssue "7" @default.
• W2019211897 hasLocation W20192118971 @default.
• W2019211897 hasOpenAccess W2019211897 @default.
• W2019211897 hasPrimaryLocation W20192118971 @default.
• W2019211897 hasRelatedWork W1627079514 @default.
• W2019211897 hasRelatedWork W2019211897 @default.
• W2019211897 hasRelatedWork W2122409876 @default.
• W2019211897 hasRelatedWork W2136125726 @default.
• W2019211897 hasRelatedWork W2152043746 @default.
• W2019211897 hasRelatedWork W2613116180 @default.
• W2019211897 hasRelatedWork W2887974702 @default.
• W2019211897 hasRelatedWork W3086075945 @default.
• W2019211897 hasRelatedWork W350479941 @default.
• W2019211897 hasRelatedWork W2101344442 @default.
• W2019211897 hasVolume "44" @default.

• next