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• W2019361489 abstract "The electromigration (EM) lifetime in short copper interconnects is modeled using a previously developed means of generating realistic interconnect microstructures combined with the one-dimensional stress evolution equation of Korhonen et al. [J. Appl. Phys. 73, 3790 (1993)]. This initial analysis describes the void nucleation and subsequent growth in lines blocked at one end and terminated with a pad at the other. For short copper interconnects, the failure time is largely spent on void growth, and, for sufficiently short lines (≲50 mm), the growth is largely steady state. This allows for the development of a simple expression for the variation of the failure time with microstructure. Assuming that the diffusion activation energies are normally distributed, the permanence property of summed lognormals leads to a roughly lognormal distribution for EM failure times. Importantly for EM design rules, linear extrapolation on lognormal plot is found to slightly underestimate interconnect reliability." @default.
• W2019361489 created "2016-06-24" @default.
• W2019361489 creator A5010152727 @default.
• W2019361489 date "2008-09-01" @default.
• W2019361489 modified "2023-10-16" @default.
• W2019361489 title "Modeling the electromigration failure time distribution in short copper interconnects" @default.
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• W2019361489 doi "https://doi.org/10.1063/1.2970171" @default.
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