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- W2019918055 abstract "Electroless Ni/Au plating is often performed on a surface of a Cu pad to improve the wettability of lead-free solders on such a pad. Generally, electroless Au plating is performed by an immersion plating method. Since a substitution reaction of Ni and Au occurs selectively on the surface of a Ni layer in immersion plating, the Au layer does not uniformly form on the Ni layer and microvoids or microcracks easily form at the Ni/Au interface. Such defects induce void formation at the joint interface in soldering, and consequently degrade the reliability of the lead-free solder joint. In this study, the influences of immersion plating time on microvoid formation at the joint interface and the reliability of a solder ball joint with a Sn–3 mass%Ag–0.5 mass%Cu lead-free solder were investigated." @default.
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- W2019918055 date "2005-01-01" @default.
- W2019918055 modified "2023-09-27" @default.
- W2019918055 title "Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint" @default.
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- W2019918055 doi "https://doi.org/10.2320/matertrans.46.2725" @default.
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