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- W2019940069 abstract "This paper describes the application of grain boundary diffusion and oxidation to the technologically important topics of solderability and thermocompression bondability. Copper leads plated with 0.73 μm of gold were studied. Arrhenius plots were constructed and extrapolated to expected storage conditions. A storage life of greater than 2 a at 50°C is predicted for both properties. The time to loss of solderability is given by ts = 1.6 x 10-7 exp(0.8 eV/kT) h and the time to loss of bondability by tB = 4 x 10-10 exp(1.0 eV/kT) h. The effective activation energies 0.8 and 1.0 eV compare with 0.91 eV for the grain boundary diffusion of copper through gold. Loss of solderability and loss of bondability were modeled as a two-step series event. First the copper diffuses to the gold surface via its grain boundaries. The copper then oxidizes. Auger analysis indicates that the surface oxide is Cu2O." @default.
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- W2019940069 title "Applications of grain boundary diffusion studies to soldering and thermocompression bonding" @default.
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- W2019940069 doi "https://doi.org/10.1016/0040-6090(78)90033-0" @default.
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