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• W2020115908 startingPage "015012" @default.
• W2020115908 abstract "Micro injection molding offers a promising approach to rapidly produce thermoplastic microfluidic substrates in large volumes. Many research works have been focused on the replication fidelity of microstructures by injection molding. However, there has not been any investigation on the effect of molded-in residual stress on microchannel deformation during the subsequent thermal bonding process. These effects could be important, because the residual stress developed due to anisotropic polymer flow orientation and inhomogeneous cooling may lead to abnormal microchannel distortion. In the direct thermal bonding process, asymmetric cross-sectional distortion was observed in well-formed microchannels aligned perpendicular to the polymer melt injection direction. This asymmetric distortion is attributed to the residual stress introduced into the substrates during molding, particularly in the surface region where microchannels are molded. Design of experiment on injection molding was carried out to reduce the residual stress in order to achieve the lowest microchannel deformation irregularity, which is a new term defined in this study. The direct thermal bonding was utilized as a feasible non-destructive indirectly quantitative method to evaluate the effect of residual stress around microchannel regarding deformation irregularity. The dominant molding parameters with positive effects were found to be melt temperature, mold temperature as well as cooling time after packing. The presence of the residual stress was also demonstrated through photoelastic stress analysis in terms of phase retardation. With improved molding condition, the absolute retardation difference around microchannels aligned parallel and perpendicular to the molding direction could be tuned to the same level, which indicates that the molded-in residual stresses have been moderated." @default.
• W2020115908 created "2016-06-24" @default.
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• W2020115908 date "2013-01-01" @default.
• W2020115908 modified "2023-10-16" @default.
• W2020115908 title "Effect of injection-molding-induced residual stress on microchannel deformation irregularity during thermal bonding" @default.
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• W2020115908 doi "https://doi.org/10.1088/0960-1317/24/1/015012" @default.
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