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- W2020192844 abstract "Interfacial stability of electroplated copper on a 5nm ruthenium film supported by silicon, Cu∕(5nmRu)∕Si, was investigated using Rutherford backscattering and high-resolution analytical electron microscopy. Transmission electron microscopy (TEM) imaging shows that a 5nm Ru film is amorphous in contrast to the columnar microstructures of thicker films (20nm). Direct Cu plating on a 5nm Ru film yielded a homogeneous Cu film with over 90% plating efficiency. It is demonstrated that 5nm Ru can function as a directly plateable Cu diffusion barrier up to at least 300°C vacuum anneal. TEM reveals an interlayer between Ru∕Si, which expands at the expense of Ru upon annealing. Electron energy loss spectroscopy analyses show no oxygen (O) across the Cu∕(5nmRu)∕Si interfaces, thereby indicating that the interlayer is ruthenium silicide (RuxSiy). This silicidation is mainly attributed to the failure of the ultrathin Ru barrier at the higher annealing temperature." @default.
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- W2020192844 date "2005-02-21" @default.
- W2020192844 modified "2023-10-17" @default.
- W2020192844 title "5nm ruthenium thin film as a directly plateable copper diffusion barrier" @default.
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- W2020192844 doi "https://doi.org/10.1063/1.1867560" @default.
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